Qualcomm unveils Snapdragon X2 Plus, Dragonwing IQ10 robotics stack at CES 2026

Unlike its competitors such as Nvidia and Intel, Qualcomm does not appear to be organising its own keynote at CES 2026. However, the chipmaker appears to still have plenty up its sleeve with CEO Cristiano Amon expected to make a special guest appearance at Lenovo Tech World on January 6 (5pm PST or 6:30am IST).

Here’s a look at what Qualcomm has announced and will have on show at the world’s largest tech expo.

Snapdragon X2 Plus

Qualcomm’s latest entrant to its Snapdragon X Series, the Snapdragon X2 Plus, has been unveiled at CES 2026. It features the 3rd Gen Qualcomm OryonCPU and offers 80 TOPS NPU to provide speed, multi-day battery life, and AI power to Copilot+ PCs. X2 Plus-powered devices will arrive in early 2026, the company said.

Snapdragon X2 Elite chips, Qualcomm’s next-gen mobile CPUs, will also be showcased at CES 2026, which is seen as a launch pad for new laptops coming to the market.

The Snapdragon X2 Elite and X2 Extreme were first unveiled at Qualcomm’s Snapdragon Summit in September 2025. They are designed to power personal computers capable of running the latest AI software. The X2 Elite and X2 Extreme are sequels to its game-changing PC chips, aiming to bring Windows laptops up to par with Apple Silicon–powered MacBooks.

Dragonwing IQ10 Series

Qualcomm on Monday announced an end‑to‑end general‑purpose robotics architecture at CES 2026. The architecture will bring industry‑leading power efficiency, safety, and scalability to personal service robots, industrial AMRs, and full‑size humanoids, as per the company.

Qualcomm introduced a full suite of robotics-focused tech to power physical AI. (Image: Qualcomm)

It will be powered by the new Qualcomm Dragonwing IQ10 Series along with a strong partner ecosystem, enabling the accelerated deployment of advanced robotics across retail, logistics, manufacturing, and more.

Automotive solutions

Qualcomm will be showing off its advanced automotive solutions such as the Snapdragon Digital Chassis which enables a broad range of connected experiences in a user’s vehicle with Snapdragon Auto Connectivity Platform, Snapdragon Cockpit, Snapdragon Ride, and more. Snapdragon Digital Chassis is currently powering more than 400 million vehicles across all tiers and segments, the company said.

Snapdragon Digital Chassis. (Image: Qualcomm)

Its exhibition space will also feature a concept car demo with complex AI capabilities running locally on Snapdragon Cockpit Elite as well as Qualcomm’s in-vehicle experiences such as Cockpit Experience Development Platform (CEDP). Google will showcase its auto software development environment, which includes Snapdragon virtual SoCs, including CI/CD/developer workflow, and OTA (simulated) updates.

“As SDV gains traction, we’re highlighting cloud-native development for automotive applications. Through cloud-native development, powered by Amazon Web Services (AWS), automakers can develop, test, and validate code on virtualized digital twins of the vehicle’s hardware,” Qualcomm said. Additionally, it will have a demo of Qualcomm’s AI-based data flywheel, which uses drive data to further enhance model accuracy and helps software learn and adapt to unfamiliar road scenarios.

IoT processors

Qualcomm said it is expanding its lineup of IoT processors, software, services, and tools with the new Dragonwing Q‑7790 and Q‑8750 processors designed to power on‑device AI, immersive multimedia, and strong security. The company’s recent acquisition of Augentix has aided Qualcomm in offering specialised SoCs for intelligent cameras and vision systems.

Qualcomm expands IE‑IoT ecosystem. (Image: Qualcomm)

CES 2026 attendees will be able to explore prototypes of Qualcomm Dragonwing processors on Arduino UNO Q boards as desktop PCs, real-time robotics control, connected home experiences, and object tracking and detection using a large language vision assistant (LLaVA).