Mediatek announces Dimensity 6100+ SoC for mainstream 5G smartphones

Mediatek Dimensity 6100+ uses UltraSave 3.0+ technology to reduce 5G power consumption.

Mediatek Dimensity 6100+ is an octa-core processor (Credit: Mediatek)

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MediaTek on Tuesday unveiled a new 5G smartphone chip series —Dimensity 6000 — with the launch of the Dimensity 6100+ processor. Aimed at mainstream 5G devices, the latest mid-tier 5G chip from MediaTek offers class-leading features, including sub-6GHz 5G connectivity. Phones with the Dimensity 6100+ SoC will be available from the third quarter of 2023.

The prominent features of the Dimensity 6100+ SoC include support for up to a 108 MP camera, up to 2K resolution video recording, UltraSave 3.0+ technology to reduce 5G power consumption, and the chip also offers several AI-driven features such as AI bokeh and AI colour technology. It even supports 10-bit colours.

Also read | MediaTek Dimensity 9000+ chipset launched: Here’s what’s new

Fabbed using TSMC N6 (6nm) process, the Dimensity 6100+ SoC has an octa-core CPU cluster with two high-performance 2.2GHz cores based on the Cortex-A76 architecture and six efficient 2.0GHz cores with Cortex-A55 architecture. The graphics-related tasks are handled by the Mali-G57 MC2 GPU, which can drive the display with up to a 120Hz refresh rate and FHD+ resolution.

The chip supports Bluetooth 5.2, 5GHz Wi-Fi, and is also compatible with various geo-navigation systems such as GPS, GLONASS, and even NavIC. The embedded ISP can support up to a single 108 MP camera or drive up to two 16 MP sensors.

Regarding 5G network capabilities, the embedded 5G model on the Dimensity 6100+ is compatible with low-band ENDC and 8-layer DL MIMO technologies, and it can utilize up to a maximum of 140MHz cellular spectrum to deliver up to 3.3Gbps download speeds via the 5G network.