Bhumi Pujan of Rs 27,000 crore semiconductor assembly and test facility conducted in Assam

The proposed capacity of the unit is 4.83 crore semiconductor chips per day. According to a statement from the office of Union Minister for Electronics and IT Ashwini Vaishnav this unit will be the site for development of indigenous advanced semiconductor packaging technologies including Wire Bond, flip chip and I-SIP (integrated system in package) technologies and all these three major technologies which will be deployed in this plant are being developed in India.

Chandrasekaran was in Assam for the ‘bhoomi poojan’ event on Saturday.

“The chips that are packaged here in Assam will cover the electric vehicles, mobile phones, laptops, healthcare devices of leading global companies around the world. When we wanted to set up this facility a couple of years ago, we looked at many locations but then decided to set it up here in Assam after a lot of deliberation and it would not have been possible but for the tremendous leadership and passion of Honourable Chief Minister Dr Himanta Biswa Sarma. The Chief Minister has made a huge impact in the last few years here in Assam and he was very determined to put Assam on the path of future technology skills, employment and create jobs which will be at the high end,” he said.

“What this will do, is once this facility expands to its capacity, it will employ 27,000 people – 15,000 direct jobs and additional 12,000 indirect jobs. But what it will additionally do is to bring the entire semiconductor ecosystem companies. We will need several people who will produce different components and as we grow, while those people will initially supply, they will set up their own units here And I see a big corridor and ecosystem of many companies developing here which we will get to see in the coming years and it will become a thriving electronics hub,” he added.

The first phase of the facility is expected to be operational by mid-2025.