Tata, Intel sign deal to explore chip packaging in India

“Intel and Tata intend to explore manufacturing and packaging of Intel products for local markets at Tata Electronics’ upcoming Fab and OSAT (Outsourced Semiconductor Assembly and Test) facilities, as well as a collaboration for advanced packaging in India,” the companies said in a press statement.

Intel and Tata will also explore the opportunity to rapidly scale tailored AI PC solutions for consumer and enterprise markets in India, which is projected to be a global top five market by 2030, they said.

“This collaboration would leverage Intel’s AI compute reference designs, Tata Electronics’ industry-leading Electronics Manufacturing Services (EMS) capabilities, and broad access to the Indian market through Tata Group companies,” they added.

Lip-Bu Tan, CEO, Intel Corporation, said, “We see this as a tremendous opportunity to collaborate with Tata to rapidly scale in one of the world’s fastest-growing compute markets, fuelled by rising PC demand and rapid AI adoption across India”.

Randhir Thakur, CEO and managing director, Tata Electronics, said, “This MoU aligns with Tata Electronics’ roadmap across EMS, OSAT, and Semiconductor Fab, enabling a reliable and resilient supply chain for our customers. This collaboration would drive cost competitiveness, faster time-to-market, greater operational agility, and enable Intel products to capture the surging demand for next-generation AI compute in India.”